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CdTe Wafers also in stock!
For PV grade silicon wafer,we can offer like as below.
1) Multicrystalline
1Kpc---------$7.50/ea.
5Kpc---------$7.30/ea.
10Kpc--------$6.90/ea.
100Kpc-------$6.80/ea.
2) Monocrystalline
1Kpc---------$6.50/ea.
5Kpc--------$5.90/ea.
10Kpc-------$5.70/ea.
100Kpc------$5.25/ea.
Solar Wafer Special
1) Si multi 150x150mm
P/Boron
Thickness 200+/-30um
Resistivity 0,5 - 3,0 Ohm*cm
2) Si multi 125x125mm
P/Boron
Thickness 200+/-30um
Resistivity 0,5 - 3,0 Ohm*cm
Material properties |
Mono-Crystalline Silicon Wafer Specification 125mm x 125mm |
Property |
Specification |
Crystallinity |
Mono-crystalline |
Donor type/Dopant |
P/Boron |
Dislocation density(Etching Pit) |
≤5000 pcs/cm2 |
Orientation |
<100>±1º |
Oxygen concentration |
≤1.0×1018 atoms/cm3 |
Carbon concentration |
≤5×1016 atoms/cm3 |
|
|
Electrical properties |
|
Property |
Specification |
Resistivity |
0.5-6.0 ohm.cm or 0.5~3.0 ohm.cm&3.0~6.0ohm.cm |
|
|
Geometry |
|
Property |
Specification |
Geometry |
Pseudo Square |
Thickness (T) |
200±20μm, refer Fig. |
TTV |
<30μm |
Dimensions (W×W) |
Refer Fig. |
Diameter (¢) |
Refer Fig. |
Saw marks |
≤15μm |
Surface quality |
As cut, cleaned |
Edge chips |
≤2 per wafer, Depth≤1.0mm, Length≤1.0mm;No edge cracks |
|
|
Package & Labels |
|
Property |
Specification |
Inner box |
200pcs/Box |
Carton box |
10 inner boxes/carton box, total 2000pcs per carton box |
Labels |
P.O. No., Lot No., No.of wafers, Dimension |
Material properties |
Multi-Crystalline Silicon Wafer Specification 156mm x 156mm |
Property |
Specification |
Crystallinity |
Multi-crystalline |
Donor type/Dopant |
P/Boron |
Oxygen concentration |
≤1.0×1018 atoms/cm3 |
Carbon concentration |
≤5×1016 atoms/cm3 |
|
|
Electrical properties |
|
Property |
Specification |
Resistivity |
0.5-2.0 ohm. cm |
Lifetime |
≥2us (u-PCD type) |
|
|
Geometry |
|
Property |
Specification |
Geometry |
Square |
Thickness (T) |
200±20μm |
TTV |
≤30μm |
Dimensions (W×W) |
Refer Fig. |
Diameter (¢) |
Refer Fig. |
Saw marks |
≤15μm |
Surface quality |
As cut, cleaned |
Edge chips |
≤2 per wafer, Depth≤0.3mm, Length≤0.5mm;No edge cracks |
|
|
Package & Labels |
|
Property |
Specification |
Inner box |
To be determined |
Carton box |
To be determined |
Labels |
P.O. No., Lot No., No.of wafers, Dimension |
|